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Environmental Policy

Due to environmental concerns worldwide, the need for environmental protection and the elimination of hazardous substances in electronic components and systems have received increased attention in the semiconductor and electronics industries.

Macroblock is committed to protecting the environment and follows closely to the regulation requirements.

Pb-Free & Green Definition

Macroblock has taken the steps to ensure our products complied with RoHS Directive (2002/95/EC) and customer’s requirements as well as to make sure they are Bromine (Br)-free and Fluorine (F)-free.

*Soldering Process of “ Pb-free ” Package Plating

  • Substance
    Standard
    Maximum Limit
    Pb-Free Product
    Green Product
  • Substance : Cadmium (Cd)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 100ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance : Lead (Pb)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 1000ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance : Mercury (Hg)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 1000ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance : Hexavalent Chromium (Cr6+)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 1000ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance : Polybrominated Biphenyls (PBBs)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 1000ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance : Polybrominated Biphenyl Ethers (PBDEs)
    Standard : RoHS Directive ( 2002/95/EC )
    Maximum Limit : 1000ppm
    Pb-Free Product : Acceptable
    Green Product : Acceptable
  • Substance :

    Chlorine (Cl)
    Bromine (Br)

    Standard : IEC 61249-2-21
    Maximum Limit :

    CI<900ppm


    Br<900ppm


    CI+Br<1500ppm

    Pb-Free Product : Acceptable
    Green Product : Acceptable

Our Pb-free semiconductor products have met the current RoHS requirements and are made using 100% pure tin (Sn) to provide both forward and backward compatibility with the current industry standards for SnPb-based soldering processes and high temperature Pb-free processes. Pure tin is widely accepted by customers and suppliers of electronic devices in Europe, Asia, and the US because the lead-free finish is preferred over tin-lead finish. Refer to JEDEC J-STD-020C for the temperature of solder bath.

  • Package Thickness
    Volume mm3 < 350
    Volume mm3 350 - 2000
    Volume mm3 ≧2000
  • <1.6mm
    260 +0 oC
    260 +0 oC
    260 +0 oC
  • 1.6mm – 2.5mm
    260 +0 oC
    250 +0 oC
    245 +0 oC
  • ≧2.5mm
    250 +0 oC
    245 +0 oC
    245 +0 oC
  • Package Thickness
    Volume mm3 < 350
  • <1.6mm
    260 +0 oC
  • 1.6mm – 2.5mm
    260 +0 oC
  • ≧2.5mm
    250 +0 oC
  • Package Thickness
    Volume mm3 350 - 2000
  • <1.6mm
    260 +0 oC
  • 1.6mm – 2.5mm
    250 +0 oC
  • ≧2.5mm
    245 +0 oC
  • Package Thickness
    Volume mm3 ≧2000
  • <1.6mm
    260 +0 oC
  • 1.6mm – 2.5mm
    245 +0 oC
  • ≧2.5mm
    245 +0 oC