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Concerning the issue of environment protection, Macroblock would like to announce our policy on “Pb-free & Green” package. Herein, we specify a term “Pb-free & Green” package describing the material ingradient of our products, and the potential impact to the customers while adopting “Pb-free & Green” package. A timeline of changing over to “Pb-free & Green” package is also proposed
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Macroblock, based on the definitions proposed by the EU in September 2003 (RoHS), defines “Pb-free & Green” products, including:
a lead (Pb) concentration that dose not exceed 0.1% of total weight, and products contain less than regulated concentrations of Cadmium (Cd), Mercury (Hg), Hexavalent Chromium ( ), PolyBrominated Biphenyis (PBB), and PolyBrominated Diphenyl Ether (PBDE), and where none has been intentionally added as part of the manufacturing process.
| EU RoHS - Directive 2002/95/EC |
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Element |
Maximum Concentration (PPM) |
| Heavy Metals |
Lead (Pb) |
1000 |
| Mercury |
1000 |
| Cadmium |
100 |
| Chromium VI |
1000 |
| Flame Retardants |
PBDE |
1000 |
| PBB |
1000 |
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Macroblcok provides backward compatibility with both the current industry-standard SnPb-based soldering processes (215ºC to 240ºC) and higher-temperature Pb-free processes (235°C-260°C). In addition, Macroblock's “Lead-free & Green” product with 100% pure Tin is fully compatible with SnPb conventional PCB process.
| Macroblock Device (DIP,SOP, SSOP, etc.) |
| Solder Paste |
SnPb package |
100% pure tin package |
| SnPb |
Yes |
Yes |
| SnAgCu |
Yes |
Yes |
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In making these changes to Pb-free solder plating materials, the 100% matte Sn materials will all require higher board mount reflow solder peak temperatures for our customers. Current Sn/Pb solder plating and epoxy mold compounds can withstand a 245°C peak temperature and still meet Moisture Sensitivity Level (MSL) 3 on all our DIP and SMD packages. The new plating materials (100% matte Sn) will require up to 260°C for proper soldering on boards. Although the IPC/JEDEC J-STD-020C specification (Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices) only requires 250°C max for Pb-free products, for the epoxy package to withstand the higher temperatures, we will upgrade the mold compounds.
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Macroblock has evaluated “Pb-free & Green” material with SMD & DIP package types, they are met the definition of EU RoHS in 2003. We have sampled the RoHS of all Macroblock's products in May, 2005, and have released them for production from beginning of August, 2005.
For “Pb-free & Green” package, the PCB soldering process has to be changed in temperature, from the peak 225°C of Sn/Pb to 250°C of pure Tin (Sn) (refer to JEDEC22-A113C). |
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